- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/22 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate using similar magnetic field effects
Patent holdings for IPC class H01L 27/22
Total number of patents in this class: 4090
10-year publication summary
|
262
|
364
|
399
|
430
|
600
|
670
|
462
|
329
|
280
|
45
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
474 |
| Samsung Electronics Co., Ltd. | 131630 |
433 |
| International Business Machines Corporation | 60644 |
329 |
| Kioxia Corporation | 9847 |
317 |
| SK Hynix Inc. | 11030 |
193 |
| TDK Corporation | 6306 |
162 |
| United Microelectronics Corp. | 3921 |
138 |
| Intel Corporation | 45621 |
117 |
| Integrated Silicon Solutions, (Cayman) Inc. | 220 |
117 |
| Everspin Technologies, Inc. | 474 |
101 |
| GLOBALFOUNDRIES Singapore Pte. Ltd. | 734 |
98 |
| Sony Corporation | 32931 |
92 |
| Micron Technology, Inc. | 24960 |
92 |
| Qualcomm Incorporated | 76576 |
90 |
| JPMorgan Chase Bank, National Association | 10964 |
72 |
| Avalanche Technology, Inc. | 299 |
70 |
| Sandisk Technologies LLC | 5684 |
65 |
| Toshiba Corporation | 12017 |
45 |
| Tohoku University | 2526 |
44 |
| Changxin Memory Technologies, Inc. | 4732 |
43 |
| Other owners | 998 |